9, 2012 /PRNewswire/ -- SEMICON Europa -- SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has signed a JDP Program with ASSID from Fraunhofer-IZM to research sub-175 degrees C dielectric films in through silicon vias (TSV) for 3D-IC packaging.
By integrating the PECVD modules with etch processes on a single wafer handler, ASSID uses the Versalis system to optimize process results and reduce capital expenditure for development and pilot production.
We look forward to helping IZM develop and implement 3D-IC processes inside the new ASSID
facility, and ultimately into volume manufacture.
At Fraunhofer IZM-ASSID, we develop highly tailored processes for leading semiconductor manufacturers with very different requirements, and we need flexible and scalable process solutions to meet a wide variety of needs," said Jurgen Wolf, manager and coordinator of ASSID.
We look forward to a mutually beneficial cooperation with Fraunhofer IZM and its ASSID project, and taking our industry-leading technology and process expertise in 3D packaging to a new level.
In April 1999, the Assids leased the entire tract to a Pennsylvania limited partnership known as Spring Church, L.