The cure kinetics of the ATBN modified epoxy resin during cure was investigated using a differential scanning calorimeter (DuPont 910 DSC and 990 thermal analyzer).
The viscosity rise of the ATBN modified epoxy system during cure was measured with an RMS (rheometric mechanical spectrometer) parallel plates geometry.
In this study, the ATBN modified epoxy system was investigated, and the balance equations for the RIM process were solved simultaneously by computer using the explicit FDM.
10) were employed in this ATBN modified epoxy RIM process since the ATBN contents were very small.
m] size of the ATBN modified epoxy system decreased as the isothermal curing temperature was increased (6).
Figure 12 shows the SEM micrographs for the molded ATBN modified epoxy resin sampled at the radial position of 30 mm and the two vertical positions of the center and the wall.
and 90 [degrees] C and with varying ATBN contents of 5, 10, 15, 20, and 30 wt%.
The compatibility between DGEBA and ATBN system was already reported in the previous study (18) through cloud point measurements.
The change of the scattered light intensity with time at the isothermal curing temperature of 90 [degrees] C and the composition of ATBN 10 wt% is shown in Fig.
The optical micrograph of the ATBN 20 wt%-epoxy system, obtained at the cure time of 50 s, indicated the modulated structure.
From the results of the light scattering data, the final domain correlation length was calculated for different ATBN compositions of 5 to 20 wt% and isothermal curing temperatures of 50 to 110 [degrees] C.
cp] at 10 to 15 wt% ATBN when cured at 50 [degrees] C agreed well with the result of the phase diagram which showed critical composition of ATBN 10 wt% at the moderately low conversion.