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Ltd's package assembly and test line for their 8SOP HVIC product line from STS Semiconductor and Telecommunication in Korea and has started mass production as of November 2006. HO CHI MINH CITY, Vietnam -- Intel Corporation announced today that it will increase the size of the assembly and test facility it is building in Vietnam from 150,000 square feet to 500,000 square feet and raise its investment from the USD$300 million announced in February to USD$1 billion. This new factory complements our existing flip chip assembly and test capabilities and our association in the Common Platform ecosystem, and it enhances Amkor's position as the industry's leading provider of turnkey flip chip assembly and test services. |
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