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BEOL |
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Semiconductor solutions in ALD/CVD continue to be enabled with our VULCAN[TM] with latest implementation of our Multi-pole Inductively Coupled Plasma (M-ICP) Etch Technology for added next generation Soft-etch and pre-cleaning capabilities within the system for BEOL (Back End-Of-the-Line) applications. This foundry currently employs the ANTARES system for various FEOL and BEOL particle removal processes, and with this order is adding capacity for more in-line parametric test clean up at the 65 and 90nm technology generations. With integrated address generation function and up to 40 per-channel SMUs, the N9201A option quickly and efficiently provides improved characterization of the yield degradation of the wiring and vias at BEOL. |
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