(redirected from Back-End-of-Line)
BEOLBack-End-of-Line (electronics)
BEOLBent's Old Fort National Historic Site (US National Park Service)
BEOLBent's Old Fort National Historic Site (La Junta, Colorado)
References in periodicals archive ?
The Aspen III ICPHT provides increased throughput, improved process performance and reliability for front-end-of-line (FEOL) and back-end-of-line (BEOL) strip applications.
With our latest product introduction - the EVG150XT - we've successfully combined both areas of expertise to provide our customers with the industry's first true HVM resist processing system that can meet their most demanding requirements for mid-end and back-end-of-line applications," stated Paul Lindner, executive technology director at EV Group.
In addition to LED application environments, MEMS, semiconductor, compound semiconductor and power device markets can leverage the ICOS WI-2280 tool for back-end-of-line and post-dicing outgoing quality control or binning; front-end-of-line patterned wafer inspection for baseline yield improvement, rework, excursion control or overlay; and 2D surface inspection and metrology.
Schulz, head of back-end-of-line operations at Fraunhofer ENAS.
The customer will use the system for back-end-of-line (BEOL) cleaning processes.
Back-end-of-line (BEOL) applications include inter-metal and inter-layer dielectrics, copper diffusion barrier films, low dielectric constant capping layers, and final passivation layers.
The second customer is a foundry producer and will use the system for back-end-of-line (BEOL) cleaning processes.
In addition to configurations for sensitive structure defect removal, Velocity systems are available for both aluminum (Al) and copper (Cu) back-end-of-line (BEOL) post etch/ash cleaning and for front-end-of-line (FEOL) post ash cleaning applications.
The UniFire has been put into production for both front-end-of-line and back-end-of-line semiconductor and magnetic device manufacturing processes, and for applications including advanced packaging, lithography, etch, chemical mechanical polishing (CMP) and thin film deposition.
The GAMMA Express platform can be used for both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications while providing the highest levels of technology, reliability and productivity for bulk and high dose implant strip at advanced nodes.
It reaffirms the critical capabilities of the ORION system and validates that the system is production ready for both FEOL and back-end-of-line (BEOL) applications.
The GAMA platform is adaptable to cleaning, stripping and etching steps for front- and back-end-of-line IC manufacturing on silicon wafers, as well as for other substrates such as photomasks and glass plates.