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Oki Electric will invest 100 million yen in manufacturing capacity of chip-on-flex modules for LCD drivers. LiveFlex uses standard Chip-on-Flex packaging that decouples the sensing elements from the fragile silicon die, and uniquely delineates the size of the silicon, determining cost, from the size of the sensor, determining security. CiP Technology combines semiconductor packaging with built-in connector systems, resulting in significant advantages over traditional chip-on-flex and chip-on-board solutions. |
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