SET, based in Saint Jeoire, France, is the former device bonder division of SUSS MicroTec, and a leading global supplier of high accuracy device bonders, including chip-to-wafer
tools for 3D integration and versatile nanoimprint lithography (NIL) solutions.
The new 3-D options include both wafer-to-wafer stacking and chip-to-wafer stacking.
With chip-to-wafer stacking a number of combinations are under investigation including memory and logic.
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration
GRENOBLE, France -- CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1om) chip-to-wafer structures made by direct metallic bonding.
It has a wealth of experience in process industrialization for MEMS products and offers key manufacturing technologies on 8-inch wafers for micro-machined devices including inertial sensors, micro-mirrors and RF MEMS, wafer-level packaging techniques for wafer-to-wafer and chip-to-wafer
bonding and a variety of TSV (Through Silicon Via) technologies.
Thompson will be based at the Replisaurus facility in Saint Jeoire, France, where he will manage the development of the fully integrated ECPR equipment line, as well as extension and enhancement of the high-accuracy chip-to-chip and chip-to-wafer
bonding products developed by S.
Its chip-to-chip and chip-to-wafer
bonding platforms can be adapted to all bonding technologies from fluxless reflow through most types of adhesives to thermo compression bonding.
Alignment and bonding of wafer-to-wafer or chip-to-wafer
Customers can assemble with HyCap(R) using chip-to-chip, chip-to-wafer
or wafer-to-wafer techniques.
This success stems in part from our leadership in 3D integration, precise circuitry alignment for both chip-to-wafer
and wafer-to-wafer bonding, and our support of volume MEMS production.
The EVG540C2W chip-to-wafer
bonder permanently bonds a wafer with single devices, e.