bonding, chips can be tested before bonding to ensure that only known good die are joined together-enabling higher device yields.
stacking a number of combinations are under investigation including memory and logic.
GRENOBLE, France -- CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1om) chip-to-wafer structures made by direct metallic bonding.
The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations.
Its chip-to-chip and chip-to-wafer
bonding platforms can be adapted to all bonding technologies from fluxless reflow through most types of adhesives to thermo compression bonding.
Customers can assemble with HyCap(R) using chip-to-chip, chip-to-wafer
or wafer-to-wafer techniques.
This success stems in part from our leadership in 3D integration, precise circuitry alignment for both chip-to-wafer and wafer-to-wafer bonding, and our support of volume MEMS production.
The company's EVG500 series also includes the EVG540C2W chip-to-wafer bonder with advanced-chip-to-wafer (AC2W) technology developed with Datacon Technology GmbH.
The EVG540C2W chip-to-wafer bonder permanently bonds a wafer with single devices, e.
Rutterschmidt continues: "The industry was waiting for an economical solution for chip-to-wafer bonding.