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DRIE
(redirected from Deep Reactive Ion Etching)

    Also found in: Wikipedia 0.10 sec.
AcronymDefinition
DRIEDeep Reactive Ion Etching
DRIEDepartment of Regional Industrial Expansion (Canadian)
DRIEData Recovery Information Exchange (Canada)


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Equipment used only in the production of some type of MEMS device: deep reactive ion etching (inkjet heads, accelerometers, gyroscopes), sacrificial layer etching (pressure sensors, gyroscopes, accelerometers, DLP, microphones), dual-side alignment (backside etching of pressure sensors, wafer level packaging), thick resist coating.
Research and Markets: MEMS Equipment Market Estimated to Grow to $650 ... by Business Wire
The processing functions of waferbonding, backside alignment and Deep Reactive Ion Etching of silicon are well established and there is ample choice of equipment and, generally, a good supply of services.
Research and Markets: Front-End Manufacturing Equipment Suppliers for ... by Business Wire
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