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F3000 |
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These technologies will be realized by combining Fujitsu's advanced semiconductor process technologies with Advantest's electron beam exposure system F3000 which was introduced to the market on October 24. Tokyo, Japan, Oct 26, 2006 - (JCN) - Advantest Corporation announced availability on October 24 of the F3000 electron beam (EB) lithography system, which supports 300 mm wafer process technology and 65 nm rule devices - and smaller. Developmental EB 43-25 combines Irgaguard F3000 with a proprietary additive. |
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