By adding a FOUP
loader and moving the Helios NanoLab 1200AT near-line, we can deliver first results many times faster than the hours or days typical when working with wafer pieces in a laboratory outside the fab.
A built in wafer buffer in the unloader workcell provides capability to unload the processed wafer FOUP
without interrupting the process tool.
In turn, chipmakers see a reduction in FOUP
delivery times, as well as an increase in fab-wide transport capacity.
The standard ELAN SOI system includes two single station bond modules, a high-resolution IR inspection module, a central Material Handling Unit (MHU) with a robust wafer handling robot and precise prealigner, and two FOUP
loadports - all within the smallest cleanroom footprint in the industry.
The FlexTRAK-WR system is available in two versions, one for processing wafers up to 200 mm in diameter in open cassettes or SMIF pods, and one for processing wafers up to 300 mm in diameter in FOUP
The FlexTRAK-WR "300" system is for wafers up to 300 mm in diameter in FOUP
Metryx also offers 300 mm FOUP
configurations within the Mentor line of products.
The AL110-12 is FOUP
and FOSB compatible and a superb solution for lower cost back-end inspection requirements.
GAMA integrates with most wafer handling automation including SMIF and FOUP
For high throughput operation in a 300 mm fab, the Turbo is equipped with four wafer load ports that allow the Turbo to act as a wafer FOUP
buffer and help to minimize transportation and queuing delays.
Upon delivery to a process tool, the FOUP
is placed onto the load port module.
While Entegris produced several royalty-generating patent licenses in the past, this is the first one on its 300 mm FOUP
and FOSB wafer carrier portfolio.