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FOUPFront Opening Unified Pod
FOUPFriends of University Park (UK)
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By adding a FOUP loader and moving the Helios NanoLab 1200AT near-line, we can deliver first results many times faster than the hours or days typical when working with wafer pieces in a laboratory outside the fab.
A built in wafer buffer in the unloader workcell provides capability to unload the processed wafer FOUP without interrupting the process tool.
In turn, chipmakers see a reduction in FOUP delivery times, as well as an increase in fab-wide transport capacity.
The standard ELAN SOI system includes two single station bond modules, a high-resolution IR inspection module, a central Material Handling Unit (MHU) with a robust wafer handling robot and precise prealigner, and two FOUP loadports - all within the smallest cleanroom footprint in the industry.
The FlexTRAK-WR system is available in two versions, one for processing wafers up to 200 mm in diameter in open cassettes or SMIF pods, and one for processing wafers up to 300 mm in diameter in FOUP pods.
The FlexTRAK-WR "300" system is for wafers up to 300 mm in diameter in FOUP pods.
Metryx also offers 300 mm FOUP configurations within the Mentor line of products.
The AL110-12 is FOUP and FOSB compatible and a superb solution for lower cost back-end inspection requirements.
GAMA integrates with most wafer handling automation including SMIF and FOUP.
For high throughput operation in a 300 mm fab, the Turbo is equipped with four wafer load ports that allow the Turbo to act as a wafer FOUP buffer and help to minimize transportation and queuing delays.
Upon delivery to a process tool, the FOUP is placed onto the load port module.
While Entegris produced several royalty-generating patent licenses in the past, this is the first one on its 300 mm FOUP and FOSB wafer carrier portfolio.