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Inters new Flip Chip Ball Grid Array package also uses a tin/silver/copper alloy to connect the The chip is housed in a 31x31mm flip chip ball grid array (FCBGA) package and is implemented in 130nm standard CMOS process. Intel's new Flip Chip Ball Grid Array package (Figure 1) also uses a tin/silver/copper alloy to connect the chip package to the motherboard. |
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