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20-23 IMAPS Topical Workshop and Exhibition on Flip Chip Technologies Austin Marriott at the Capitol Austin, TX Contact: www. Bumping is the building up of material on chip bond pads to span the gap between the pads and the substrate and has been an essential part of flip chip technologies," said Dr. We are pleased that Amkor, the world's largest subcontractor, has taken advantage of this enhanced arrangement with Flip Chip Technologies," added Vice President, Technology Licensing Don R. |
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