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It was originally developed for SOI wafers, but is applicable to a wide range of products from ultra-thin SOI to advanced heterostructures such as Germanium-on-Insulator and multi-layered stacked SOI wafers. Isonics is involved in several customer-specific wafer development programs and is also prepared to undertake joint development programs in the areas of germanium-on-insulator, strained silicon, or We believe that next-generation layer-transfer products including ultra-thin SOI and heterogeneous wafer systems such as Germanium-on-insulator (GeOI) are responsible for the heightened interest in our plasma-bond technologies. |
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