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They can take the abuse of lead-free soldering, have better moisture resistance, are rapidly shaped into precise 3-D structures and are halogen free. The polymers are halogen free, offering UL 94V-0 flame resistance down to 0. Proposed paper topics include: microelectronics applications; ceramics for future electronics; microvia, high-density interconnect (HDI) laminates; chip-scale package (CSP), flip chips, area array packages; advanced interconnect; integrated passives and system in package (SP); lead-free and halogen free electronics; MEMS, MOEMS and opto; and introducing new technologies to the production floor. |
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