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Since footprint pressure is closely related to hydroplaning resistance, lower aspect ratio tire hydroplaning resistance is not as high as that of high aspect ratio tires. Achieving quality electrolytic copper metallization during the production of high aspect ratio PCBs, such as back panels, isn't easy. Models based on this mechanism explain why deposition of metal occurs predominantly at the bottom of sub-micrometer dimension trenches and vias, leading to bottom-to-top filling of high aspect ratio features, an essential ingredient of integrated circuit fabrication in today's electronics. |
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