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HASL |
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You could choose either hot air solder leveling (HASL) or electrolytic nickel/gold. The OSP is part of the copper protective coating system that is used as an alternative to hot air solder leveling and other metallic printed wiring board (PWB) final finishes. As for surface finishes, hot air solder leveling (HASL) is used for eutectic boards, but is not conducive to lead-free assembly. |
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