InGaP

AcronymDefinition
InGaPIndium Gallium Phosphide
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The D5 InGaP HBT process offers an advantage of a wider (2x) frequency tuning range, in addition to maintaining the super low phase noise performance offered by our already successful D1 VCO process , commented Brian Ann, Chief Executive Officer of GCS.
These devices utilize the company's proven high reliability, high voltage InGaP HBT technology to realize 8 to 10 points greater efficiency when compared to similar silicon LDMOS devices.
A Phase 2 human clinical trial with the new combination therapy, consisting of DiaKine's Lisofylline (LSF) and Kinexum's INGAP peptide, is expected to begin in late 2008.
NASDAQ:WJCI), a leading designer and supplier of radio frequency (RF) products and solutions for the wireless infrastructure and radio frequency identification (RFID) reader markets, today introduced the availability of WJA1021, the latest addition to the WJA family of +5V active bias InGaP HBT gain block amplifiers.
US-based Alpha Industries Inc has introduced what it claims to be the world's first tri-band power amplifier module based on InGaP HBT (indium gallium phosphide heterojunction bipolar transistor) process technology.
We believe that a two-prong approach with an immune modulator such as LSF, in combination with an islet cell growth factor, such as INGAP Peptide, offers the best hope of allowing the body to generate insulin-producing cells.
Recently, InGaP HBT capability has been taken to the next level with the introduction of a series of intermediate power amplifiers.
The Company is also a leading manufacturer of InGaP HBT and recently introduced its second-generation InGaP HBT process.
This technology utilizes the excellent etch selectivity and surface charge screening properties of InGaP material.
5 dB gain at 2140 MHz MMG3014N: - InGaP HBT - DC to 4 GHz - 24 dBm P1dB output power and 20 dB gain at 900 MHz MMG3015N: - InGaP HBT - DC to 6 GHz - 21 dBm P1dB output power and 15.
TriQuint uses its advanced InGaP HBT process technology for the amplifier, affording high integration and a resulting smaller device size, thus simplifying circuit board design while lowering the external parts count.