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IMD
(redirected from Inter-Metal Dielectric)

     0.03 sec.
AcronymDefinition
IMDInstitute for Management Development (Switzerland)
IMDIntermodulation Distortion
IMDIndia Meteorological Department
IMDIndex of Multiple Deprivation
IMDInformation Management Division
IMDInstitutions for Mental Diseases
IMDInteractive Media Design (University of Dundee, Scotland)
IMDImmunodeficiency
IMDIn Mold Decorating (plastics injection molding)
IMDIntegrated Missile Defense
IMDInter-Metal Dielectric
IMDInteractive Multimedia Design (University of Ulster, Belfast, Ireland)
IMDIntegrated Mechanical Diagnostics
IMDIntegrated Management Display (Compaq)
IMDIndia Millennium Deposit
IMDInteractive Map Definition
IMDInternal Management Document
IMDInternational Management and Development
IMDInteractive Missile Design
IMDInformation Management Development (Sprint)
IMDInstallation Maintenance Division
IMDIntelligent Mail Devices (United States Postal Service)
IMDInternet Multimedia Development
IMDInflation Measures Division (New Zealand)
IMDInstallation MARS Director
IMDImitative Deception
IMDInformation Management Directive
IMDIntegrated Monitoring and Diagnostics
IMDIntegrated Map Display
IMDIndustrial Model and Design
IMDIntermediate Maintenance Detachment
IMDIntelligent Missile Defense
IMDInstitutional Memory Document
IMDInformation Management Displays
IMDIndustrial Management and Design (Research Group; Aston University, Birmingham, UK)
IMDInstitute for Music Development (Ghana)


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? References in periodicals archive
The new 45nm process combines the most advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.
TSMC Expects to Enter 45nm Production in September by Business Wire
The advanced Applied Centura(R) Ultima HDP-CVD(R) is already system of record at both 65nm logic and 70nm memory customers for applications as diverse as shallow trench isolation (STI), pre-metal dielectric (PMD), inter-metal dielectric (IMD) and passivation fill.
Applied Materials Achieves Milestone 1,000th HDP-CVD System Shipment by Business Wire
Even though the ISSCC paper detailed FTEOS in the back-end, Chipworks was surprised to find FSG as the inter-metal dielectric, since IBM's foundry publicity includes low-k dielectric.
Chipworks Discovers IBM Strain at 90nm, Delay in Low-k by Business Wire
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