Also found in: Encyclopedia.
KGDKishimoto Gordon Dalaya PC (architectural firm)
KGDKing's Gambit Declined (chess)
KGDKomitee Für Grundrechte Und Demokratie
KGDKilograms per Day
KGDKnown Good Die (semiconductor industry)
KGDKaliningrad, Russia - Kaliningrad Airport (Airport Code)
References in periodicals archive ?
While further studies are needed to determine the applicability of a KGD in adult patients, as well as the longterm outcomes, the findings suggest it is safe and feasible, Dr.
These are offered in small footprints such as KGD (known good die) and WLCSP (wafer-level chip-scale packages).
Logic and memory combinations are increasing as KGD and logistics issues are being resolved.
Bolen, "Flip-Chip on Module Application," 10th Annual KGD Packaging and Test Workshop, Napa, CA, September 2003.
Designed by KGD Architecture, 7901 Westpark will stand prominently at the intersection of Westpark Drive and Galleria Drive, one block from the Tysons Corner Silver Line station and overlooking the Beltway and the new 495 Express Lanes.
These products are now available in volume quantities in a full range of packages including VQFP, BGA, WLCSP and KGD (Known Good Die).
Packaging, availability and pricing The SM28VLT32-HT is sampling now in an 8-mm x 25-mm ceramic flat pack, with KGD package options and volume quantities available in 1Q13.
CEA Grenoble wishes for his site Midi-Pyrenees, to acquire a platform for industrial tests for components / power electronic devices composed of the following lots - Lot 1 - tester power components,- Lot 2 - an extension of test power modules,- Lot 3 - a robotic handler sorting chips KGD (Know Good Dies).
FormFactor delivered another record revenue quarter driven by strength in DRAM, NOR and KGD as we continued to lead the market for advanced probe cards.
8, 2012 /PRNewswire/ -- KGD Architecture welcomes Thomas Donaghy, AIA, LEED AP as Architecture Director.
Examples of KGD applications include mobile cell phones and portable media players, where multiple device types are incorporated into a single system-in-package (SiP) or multi-chip package (MCP).