LFCSPLead Frame Chip Scale Package
LFCSPLead Frame Chip Scale Packaging (analog devices)
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5V, 2ppm/[degree sign]C integrated reference and low drift; 3mm x 3mm, chip-scale 16-pin LFCSP package; 4kV HBM ESD rating; as well as choice of resolution (16, 14 or 12 bits) and interface (SPI or I2C).
The ADP5034 and ADP5024 are fully specified over the junction temperature range of -40 degC to 125 degCand both are available in a 24-lead, 4 mm x 4 mm LFCSP packages.
The HMC1099 power amplifier is externally tuned using low-cost, surface-mount components and is packaged in a compact, 32-lead, 5mm 5mm LFCSP chip.
The amplifiers are also offered in the standard SOT-89 package, as well as in smaller and more compact LFCSP packaging, to promote board area savings.
The AD8663 is available in 8-lead LFCSP and SOIC; the AD8667 is available in 8-lead MSOP and SOIC; and the AD8669 is available in 14-lead SOIC and TSSOP.
The ADRF5130 is manufactured using silicon technology, and is housed in a small 4 mm 4 mm LFCSP SMT package.
The ADG1411 is available in 4 mm X 4 mm LFCSP packages as well as TSSOP packages.
45 per unit in quantities of 1,000 and is packaged in a 3 mm x 3 mm LFCSP (lead-frame chip-scale package).
For example, the ADA4431-1 video filter integrates a third-order low-pass filter, gain of +2 amplifier, charge pump and load detector into a 3 mm X 3 mm LFCSP package.
3V Voltage regulator (TO263 Package) 2 , LT3482 70V Voltage regulator (16 lead plastic QFN package) 2 , ADN2880 Transimpedence Amplifier 2 ,ADA4817-2 OPAMP (16 lead LFCSP package) RF Connectors/adapters and adapters ,RF cables GPO (SMP) female jack to SMA male jack, length=50 cm 4 20 FPGA board X6-1000M with Xilinx Virtex XC6VSX475T FPGA, ,