OIT, a leading supplier of single-chip packaging for the semiconductor industry, is manufacturing a new generation of MBGA packages using thin film foundry services from MicroModule Systems' Cupertino, Calif.
The OIT MBGA packages, built using thin film interconnect on anodized aluminum, extend the advantages of BGA technology to very high pin count designs in excess of 600 I/O, while offering superior thermal performance when compared to laminate-based BGA designs.
Grove, MMS chairman and CEO, said "We expect the OIT MBGA program to create many high-volume thin film applications for our thin film foundry, paving the way for exciting new low-cost, highly integrated semiconductor products.
Future plans include high density multilayer, few chip MCM, and flip chip versions of the MBGA package.
Olin Interconnect Technologies provides high-performance packaging systems, including MBGA and MQUAD packages, to semiconductor manufacturers worldwide.