MCM-CMulti-Chip Module-Ceramic (technology)
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0 version for MCM-C will be available third quarter `93.
The kits are based on two Hughes technologies: HDMI(TM) (High Density Multichip Interconnect) for MCM-D, and LTCC (Low Temperature Co-fired Ceramic) for MCM-C packaging.
The MCM-C module applies existing wire bonding technology in 16 layers built on alumina ceramic substrate.
Samples of the MCM-C and MCM-L/D are available now.