MCM-CMulti-Chip Module-Ceramic (technology)
References in periodicals archive ?
The MCM-C module applies existing wire bonding technology in 16 layers built on alumina ceramic substrate.
Samples of the MCM-C and MCM-L/D are available now.
ELMO's in-house microelectronic technologies include: Known-Good-Die (KGD), 3-D Die Stacking, Chip Scale packaging, advanced MCM-L (Laminate), MCM-C (Ceramic), MCM-D (Deposited), Chip-on-Board (COB) and high performance Power MCM's.