MCM-L

AcronymDefinition
MCM-LMulti-Chip Module-Laminated
References in periodicals archive ?
ELMO's in-house microelectronic technologies include: Known-Good-Die (KGD), 3-D Die Stacking, Chip Scale packaging, advanced MCM-L (Laminate), MCM-C (Ceramic), MCM-D (Deposited), Chip-on-Board (COB) and high performance Power MCM's.