MEOMSMicro Electro-Optical-Mechanical System
References in periodicals archive ?
Technical coverage includes such topics as design for manufacturability (DFM); test and reliability (DFX); system in package (SiP), MCMs and 3-D packaging; integrated manufacturing and test; RF/microwave and high clock rate systems/sub-systems; optoelectronic, optical, MEMS and MEOMS packaging applications; and systems level energy and thermal management.