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MID
(redirected from Molded Interconnect Device)

     0.09 sec.
AcronymDefinition
MIDMiddle
MIDMidfield
MIDMobile Internet Device
MIDMusical Instrument Digital Interface (file extension)
MIDMessage Identifier (ATM)
MIDModesto Irrigation District (California)
MIDMeasuring Instruments Directive
MIDMulti-Information Display
MIDMentioned in Dispatches
MIDMechanized Infantry Division
MIDMolded Interconnect Device
MIDMild Intellectual Disability (special education)
MIDMaster of Industrial Design
MIDMilitary Intelligence Detachment
MIDMilitaire Inlichtingendienst
MIDManagement Initiative Decision (US government)
MIDMetropolitan Improvement District (Seattle, WA)
MIDMilitarized Interstate Dispute
MIDMultimedia Instructional Design
MIDManager in Development (restaurants)
MIDMinimum Infective Dose
MIDMaritime Identification Digit
MIDMaster of International Development (University of Pittsburgh)
MIDMirror Image Design
MIDMinistry of Information Development (Moldova)
MIDMilitary Intelligence Digest
MIDMinisterstvo Inostrannyh Del (Russian: Ministry of Foreign Affairs)
MIDMemory Identifier
MIDMobile Intelligent Device (mobile phone with the PDA and digital camera)
MIDMessage Identification Character
MIDModular Input Device
MIDMouse Infective Dose
MIDMechanical Interface Drawing
MIDMentioned in Dispatch (British award)
MIDMaintenance Instruction Document
MIDMultiple Interface Device
MIDMiniature Imager Device
MIDMorpho-semantic class IDentifier
MIDMessage Input Device
MIDMerida, Yucatan, Mexico - Merida International (Airport Code)
MIDMajor Identification Sign (marketing)
MIDManagement of Information Department
MIDMinistry of Internal Defence


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? References in periodicals archive
Pittsburgh, offer improved heat resistance for producing molded interconnect devices (MIDs) with integral circuitry.
PBTs tailored for MIDs by Plastics Technology
Compounds made of high-temperature thermoplastics such as liquid crystal polymer and polyethersulfone used in molded interconnect devices and low-k dielectric polymers in semiconductor fabrication are expected to register strong growth.
Thermal Management Properties of Plastics Crucial for Use in ... by Business Wire
Back in the 1980s, 3D molded interconnect devices (MIDs) were hailed as a breakthrough in electronics.
MIDs make a comeback: 3d molded interconnect devices were supposed to ... by Grande, Joseph A. / Plastics Technology
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