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Sophisticated engineering techniques such as advanced lithography masks and off-axis illumination are likely to be critical in minimizing mask error. 0 micron to 65nm process design rules, Design For Manufacture (DFM) practices to increase silicon yield and reliability, and sub-wavelength optimization Resolution Enhancement Techniques (RET): Optical Proximity Correction (OPC); Strong and Attenuated Phase-Shift Mask (PSM); Scattering Bars (SB); and Off-Axis Illumination ( 0 micron to 65nm process design rules, Design For Manufacture (DFM) practices to increase silicon yield and reliability, and sub-wavelength optimization Resolution Enhancement Techniques (RET): Optical Proximity Correction (OPC); Strong and Attenuated Phase-Shift Mask (PSM); Scattering Bars (SB); and Off-Axis Illumination ( |
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