According to Amkor, PBGAs
produced with the new PGM process and structure offer better quality, reliability and performance and can be less expensive than traditional corner gate molding.
First, both PBGA
196 and CSP 46 were removed at the same time.
cross sectional view of FIGURE 1c illustrates that signal path from die pad to the solder ball can contain wire bond, package traces and via(s).
Among the pioneering work the Institute has done is the widely adopted thermal and electrical PBGA
technology licensed to STATS.
PGM is also a more cost effective PBGA
structure as it uses higher density substrates and smaller diameter wire than traditional corner gate molding.
To determine the interdependence of body size and die size on the high-temperature warpage response for PBGA
packages and the impact on SMT assembly robustness.
The MPC8313E is available in a 516-pin PBGA
package and is manufactured using Freescale's 90-nm process technology, enabling 1.
The 24-port DSP is packaged in a 668-pin PBGA
and the AFEs are packaged in 144-pin LFBGAs.
The PEX 8517 comes in a 27x27 PBGA
package and is now sampling, with production expected in Q3.
MPC8323E family processors are manufactured on Freescale's 90nm process technology and offered in 516-pin PBGA
Packaged in a 196-pin PBGA
, the S1220 device offers a small 15 x 15 mm2 footprint, while the S1221 is packaged in a 17 x 17 mm2 255-pin PBGA
The S5543 interfaces seamlessly with AMCC's PPC 440SPe, the industry's first PCI Express based Embedded Storage Processor, and is packaged in a 13x13mm2 144-pin PBGA