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Called the JM825, the new paste is intended for high-volume, high-capacity leadframe applications, including quad flat packages (QFPs), plastic leadless chip carriers (PLCC), small outline integrated circuits (SOICs) and plastic dual in-line packages (PDIPs). BMI's STANDARD BOLDT SHIELDs are distributed in many JEDEC sizes, including 52-pin Quad Flat Pack, 256 position Ball Grid Array and 84-pin Plastic Leadless Chip Carrier packages. 2K-gate device, an 84-lead plastic leadless chip carrier (PLCC). |
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