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nbsp;that allows dense circuit routing and three-dimensional packaging. Keywords in this release: Electronic packaging technologies, system-on-chip, SoC, system-in-package, SiP, portable devices, multi-chip-modules, MCM, pin count, three-dimensional packaging technologies, stacked die packages, wire bonding techniques, wafer thinning, stand-off stitch, ultra low loop Dense-Pac Microsystems is a technology company that provides high-density electronic design and manufacturing solutions using its proprietary, patented, three-dimensional packaging. |
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