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UBM
(redirected from Under-Bump Metallization)

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AcronymDefinition
UBMUnited Business Media Plc (London)
UBMUnder-Bump Metallization
UBMUnião Brasileira de Mulheres (Portuguese: Brazilian Women's Union)
UBMUltrasound Biomicroscope (ophthalmology)
UBMUniCredit Banca Mobiliare S.p.A. (Italy)
UBMUnited Bikers of Maine
UBMUnleavened Bread Ministries
UBMUnbalanced Magnetron
UBMUltimate Building Machine
UBMUrban Background Model
UBMUnicast-Based Multicast
UBMUnpressurized Berthing Mast/Mechanism
UBMUnattended Battery Monitor
UBMUnified Battlescale Model
UBMUniversitat de Barcelona-Medicina (Ciencias de la Salud)
UBMUnited Black Men
UBMUse-Based Maintenance
UBMUpper Beaver Meadows (Rocky Mountain National Park; Colorado)


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Specifically designed for under-bump metallization (UBM), redistribution layer and CMOS image sensor applications, the Charger system's new linear architecture more than doubles the wafer output of competing systems to deliver the highest productivity available.
Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for BAW, FBAR, and RF MEMS applications.
Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, photo masks (including EUV), high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for FBARs and RF MEMS.
 
 
 
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