If the via
has less cross-sectional area than the conductor, then multiple vias
can be used to maintain the same cross-sectional area as the conductor.
Our recommended method is to plug the via
with copper or epoxy and have it plated over by the fabricator.
The PCB cross-section of FIGURE 1 shows how conventional conductive filled vias
increase the effective interconnect per PCB layer.
shut with copper during plating has its own set of challenges.
The return path for a single-ended via
is the board PDN, which will consist of stitching vias
, decoupling capacitors, and power and ground planes.
Apache Design Solutions, the technology leader in physical power integrity solutions for system-on-chip (SoC) designs, today announced that VIA
Technologies has adopted RedHawk-SDL and NSPICE-PI as part of its production physical power flow.
For differential vias
, another term that is important is the via
ESI's Advanced Packaging Group (APG) product line provides innovative, cost effective via
solutions to the high density interconnect (HDI) and advanced packaging markets.
that are used to connect the reference planes for the connected layers, and the return current is mostly conductive (FIGURE 1C).
On October 19, 1999, Semiconductor International magazine announced the winners of its "Editor's Choice Best Products Awards for 1999," and Gore's VIA
ON CHIP PITCH(TM) substrates were among the select handful of winners.
In Figure 3, all the 1:2 fanout vias
that are connected on this layer do not need to extend to Layer 3.
on Chip Pitch packages, a new category of semiconductor chip packaging.