If the via
has less cross-sectional area than the conductor, then multiple vias
can be used to maintain the same cross-sectional area as the conductor.
on HASL finished boards (leaded or lead-free) often look closed, but will melt through in the reflow oven.
are alternative interconnect strategies that help designers optimize layer utilization.
They are: thermal management, reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via
structures and via
The other reason is attributed to silkscreen; tenting the vias
will permit more room for any required silk.
are actually very nonuniform, and in some cases, depending on the application, require use of a 3D field-solver to be properly characterized and simulated.
Increasing the Quality of Physical Power Verification for VIA
There are no universally good approximations to estimate the electrical properties of single-ended or differential vias
The new system is designed in such a way that it delivers maximum throughput for via
formation in copper for HDI as well as in non-reinforced dielectrics for IC packaging applications.
-hole current return path localization may be used to separate the vias
into two groups for analysis purpose.
As ASIC and microprocessor vendors move toward full array flip chips on ever tighter bump pitches, exploiting the benefits of reducing die size and improving performance by placing vias
on the same pitch as the die will be a key to competitive differentiation.
8 mm, aligning the vias
cannot be done because there isn't enough room between the ball pads for via
patterns; in fact most of the time, there is only room to put the vias
in the pads.