VIAS


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AcronymDefinition
VIASVienna Institute for Archaeological Science (Austria)
VIASVictorian Institute of Animal Science
VIASVienna International Airport Security Services, GmbH (Flughafen Wien; Austria)
VIASVisualization Information Archival/Retrieval Service (National Center for Supercomputing Applications)
VIASVietnam Institute for America Studies
VIASVideo Image Analyzing System
References in periodicals archive ?
If the via has less cross-sectional area than the conductor, then multiple vias can be used to maintain the same cross-sectional area as the conductor.
Our recommended method is to plug the via with copper or epoxy and have it plated over by the fabricator.
The PCB cross-section of FIGURE 1 shows how conventional conductive filled vias increase the effective interconnect per PCB layer.
Plating vias shut with copper during plating has its own set of challenges.
The return path for a single-ended via is the board PDN, which will consist of stitching vias, decoupling capacitors, and power and ground planes.
Apache Design Solutions, the technology leader in physical power integrity solutions for system-on-chip (SoC) designs, today announced that VIA Technologies has adopted RedHawk-SDL and NSPICE-PI as part of its production physical power flow.
ESI's Advanced Packaging Group (APG) product line provides innovative, cost effective via solutions to the high density interconnect (HDI) and advanced packaging markets.
On October 19, 1999, Semiconductor International magazine announced the winners of its "Editor's Choice Best Products Awards for 1999," and Gore's VIA ON CHIP PITCH(TM) substrates were among the select handful of winners.
In Figure 3, all the 1:2 fanout vias that are connected on this layer do not need to extend to Layer 3.
introduced Via on Chip Pitch packages, a new category of semiconductor chip packaging.