WLCSP - What does WLCSP stand for? Acronyms and abbreviations by the Free Online Dictionary.

Acronym

Definition

WLCSP

Wafer Level Chip Scale Packing (DDR RAM package)

? References in periodicals archive
Mike Bereziuk, Tessera's executive vice president, product division, stated, "We are excited to be expanding our wafer level technology offering with the introduction of SHELLCASE([R]) RT, an advanced WLCSP technology designed to enable our customers to build higher yielding, lower profile camera modules for products which integrate a camera, such as camera phones, PDAs, laptops, and automotive-based electronics. Tessera Introduces One of the World's Thinnest Wafer-Level Chip-Size ... by Business Wire Available in 4x4mm WLCSP or 6x6mm VFBGA packages, BlueCore5-FM features the highest performance Bluetooth on the market today, offering connectivity of up to 3Mb/s and unrivalled output power of +10 dBM. CSR Announces World's First Class 1 Bluetooth Silicon by Business Wire SUSS MicroTec systems provide us with the capabilities needed to supply the latest design in solder bumping processes, especially in WLCSP and RDL, to the industry, which is driven by improved chip performance, package form factor and lower cost", comments Johnson Tai, Vice President, Manufacturing 3rd Division at SPIL. SPIL Selects Lithography Systems From SUSS MicroTec To Support Its ... by Business Wire More results

? References in periodicals archive

Mike Bereziuk, Tessera's executive vice president, product division, stated, "We are excited to be expanding our wafer level technology offering with the introduction of SHELLCASE([R]) RT, an advanced WLCSP technology designed to enable our customers to build higher yielding, lower profile camera modules for products which integrate a camera, such as camera phones, PDAs, laptops, and automotive-based electronics.

Tessera Introduces One of the World's Thinnest Wafer-Level Chip-Size ... by Business Wire

Available in 4x4mm WLCSP or 6x6mm VFBGA packages, BlueCore5-FM features the highest performance Bluetooth on the market today, offering connectivity of up to 3Mb/s and unrivalled output power of +10 dBM.

CSR Announces World's First Class 1 Bluetooth Silicon by Business Wire

SUSS MicroTec systems provide us with the capabilities needed to supply the latest design in solder bumping processes, especially in WLCSP and RDL, to the industry, which is driven by improved chip performance, package form factor and lower cost", comments Johnson Tai, Vice President, Manufacturing 3rd Division at SPIL.

SPIL Selects Lithography Systems From SUSS MicroTec To Support Its ... by Business Wire

More results