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WLCSP

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AcronymDefinition
WLCSPWafer Level Chip Scale Packing (DDR RAM package)


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Therefore, the strong demand for 65/55-nanometer and below wafer manufacturing has prompted testing and packaging companies to expand their capacity to fill orders from upstream manufacturers for wafer bumping, WLCSP (wafer level chip scale packaging) and mixed-signal integrated circuit and high-speed logic circuit testing.
For module solutions, ultra-thin WLCSP packages can be supplied with a low profile of 0.
Meeting our customers' requirements for eutectic and lead-free solder bumps, WLCSP, and 3-D interconnect has permitted NEXX to realize our most successful year in 2009.
 
 
 
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