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Austin, TX -- Flip chip and wafer level packaging will see a compound growth rate of 28% between 2004 and 2009, a new study projects. These new development tools are designed to enable more companies to enter and support the growing market for wafer level packaging by providing the basic metal deposition engines along with control and chemical delivery systems. Flip Chip and Wafer Level Packaging Market Analysis" highlights the demand and supply for wafer bumping and wafer-level packaging. |
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