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Its System in Package (SIP) support for advanced packaging includes multi-chip modules, molded chip packages, chip on board solutions, chip scale packaging, and other small form factor printed circuit board assemblies. Hana is capable of providing a wide scope of assembly processes serving a diverse range of electronic industries, which includes: semiconductor process, integrated circuit assembly and test, light emitting diodes (LED), opto electronic packages, hybrid devices, printed circuit board assembly, chip on board assembly and test, lamination, reflective liquid crystal on silicon microdisplays. The ability to probe after dicing also facilitates the delivery of KGD (Known Good Die) from various CSP (Chip Scale Package) and Chip on Board processes. |
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