The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications.
About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.
PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.
Tomorrow, significant demand will shift to FOWLP, 3DIC stacks, 3D WLP, and 2.
5D Glass / Silicon interposers and of course 3DIC integration with TSV interconnects.
WLP equipment & material market forecasts in unit, volume and revenues from 2010-2016 and based on an unique methodology to estimate realistic sales opportunities in the global Mid-end' 3DIC & wafer-level-packaging area
350+ players DATABASE screening and profiling the detailed activity of small to medium to giant equipment & material suppliers coming either from Front-end / Back-end assembly / PCB / LCD / Solar industry and active in the 3DIC & WLP area
2) 3DIC & WLP Equipment & Materials 2010 - 2016 market forecasts
Physware's accelerated technology delivers unprecedented capacity, handling in 3DIC
, package and system simulations.
5D and 3DICs
were highlighted with presentations from ASE, Besi, CEA-Leti, GlobalFoundries, IBM, IME, IMEC, NCAP, SK Hynix, Renesas Electronics, SPIL, Tohoku University, Xilinx and others.
OPTICS, CMOS, MEMS, 3DICS : Converging Into a New Breed of Photonic Devices
hybrid packaged devices and 3DICs / Integrated opto-electronic chips.