ALSICApprentissage des Langues et Systèmes d'Information et de Communication (French journal)
ALSICAluminum Silicon Carbide
Copyright 1988-2018, All rights reserved.
References in periodicals archive ?
Prior to the growth of AlN wetting layer, the Si substrate was baked in an [H.sub.2] ambient at 1100[degrees]C for 10 min to remove the native oxide and then presurface coverage on the Si substrate with AlSiC was performed for 60 seconds in order to prevent formation of amorphous [SiN.sub.x] layer.
* A higher strength and stiffness than copper, which, combined with its lightweight nature, can make AlSiC coolers more tolerant to shock and vibration.
For more information on CPS' AlSiC components, call 508/222-0614 ext.
During the 1980s, he and his team focused on composites, particularly AlSiC, for parts in electronic packaging.
CPS Corporation is offering AlSiC (Aluminum Silicon Carbide) power amplifier substrates for hybrid circuits used in wireless and commercial microwave communications infrastructures.
In addition to the electrically functional device (Si, GaAs), RF/microwave packages utilize a wide spectrum of material types ranging from traditional ceramics ([Al.sub.2][O.sub.3], BeO, AlN) and metals/alloys (Cu, Au, Ag, Al, CuAg, MoMn, Kovar) to specialized metal-matrix composites (AlSiC, CuW), clads (CuMoGu, MoNiMo), polymers (polytetrafluoroethylene, polyimide), ceramic-filled polymers and glass-cloth laminates.
AlSiC (Aluminum Silicon Carbide), a metal-matrix composite, provides highly reliable and cost-effective thermal management solutions for electronic packaging.
The CPS-AlSiC metal-matrix composites (MMC) are highly loaded with SiC, and are a new class of packaging materials that have high thermal conductivity and tailorable, low CTE.[5] The materials have been under development for several years as part of an Advanced Research Projects Agency/US Department of Defense initiative for lightweight materials for GaAs packaging.[6] These programs focused on the development of capable and robust AlSiC materials and manufacturing processes for the production of MMIC packaging.
This module consists of various MMIC devices, a control hybrid circuit and other support circuitry in an aluminum silicon carbide (AlSiC) housing.