The Champion of Health Care Innovation Award, presented by ALSIC
in conjunction with Recovery Idaho, Idaho Chapter of the National Hemophilia Foundation and the Northwest Parkinsons Foundation, recognizes Senator Crapos efforts in Congress to position America as a leading force in health care innovation.
Prior to the growth of AlN wetting layer, the Si substrate was baked in an [H.sub.2] ambient at 1100[degrees]C for 10 min to remove the native oxide and then presurface coverage on the Si substrate with AlSiC
was performed for 60 seconds in order to prevent formation of amorphous [SiN.sub.x] layer.
<< TIC, taches et nativisation : impact sur la production orale en L2 >>, ALSIC
, 2009, volume 12.
* A higher strength and stiffness than copper, which, combined with its lightweight nature, can make AlSiC
coolers more tolerant to shock and vibration.
For more information on CPS' AlSiC
components, call 508/222-0614 ext.
During the 1980s, he and his team focused on composites, particularly AlSiC
, for parts in electronic packaging.
CPS Corporation is offering AlSiC
(Aluminum Silicon Carbide) power amplifier substrates for hybrid circuits used in wireless and commercial microwave communications infrastructures.
In addition to the electrically functional device (Si, GaAs), RF/microwave packages utilize a wide spectrum of material types ranging from traditional ceramics ([Al.sub.2][O.sub.3], BeO, AlN) and metals/alloys (Cu, Au, Ag, Al, CuAg, MoMn, Kovar) to specialized metal-matrix composites (AlSiC
, CuW), clads (CuMoGu, MoNiMo), polymers (polytetrafluoroethylene, polyimide), ceramic-filled polymers and glass-cloth laminates.
(1) Voir articles dans la revue electronique Alsic
(Aluminum Silicon Carbide), a metal-matrix composite, provides highly reliable and cost-effective thermal management solutions for electronic packaging.
The CPS-AlSiC metal-matrix composites (MMC) are highly loaded with SiC, and are a new class of packaging materials that have high thermal conductivity and tailorable, low CTE. The materials have been under development for several years as part of an Advanced Research Projects Agency/US Department of Defense initiative for lightweight materials for GaAs packaging. These programs focused on the development of capable and robust AlSiC
materials and manufacturing processes for the production of MMIC packaging.
This module consists of various MMIC devices, a control hybrid circuit and other support circuitry in an aluminum silicon carbide (AlSiC