ALTICAluminum-Titanium-Carbon (common substrate material for microelectronics)
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To create the pattern of the etching mask on the AlTiC substrate, the wafer was processed with a conventional photolithography process.
Then, the patterned AlTiC substrate (which had a tapered profile with the sidewall at an angle of 65[degrees]) was prepared for the polymer redeposition.
In a conventional reactive ion system, AlTiC, which is used as the base substrate/wafer with a patterned wet film photo resistance (with a thickness of approximately 20 [micro]m), is placed on an electrode that is powered by a 13.56 MHz RF generator.
We prepared the polymer redeposition on a patterned AlTiC substrate with these etching conditions for 900 minutes to make sure that the size of the redeposition material was big enough to get a signal from the attenuated total reflected infrared spectroscopy and visible Raman spectroscopy analysis.
The morphology of the bulk (the redeposition material) appears ribbon-like and adheres to the sidewall, while AlTiC's surface regions of two different step heights are etched by the plasma and then present high surface roughness.
Music Broadcast Hearts, Just Sayin', Altic, 8:30 p.m.
Broadcast Hearts performs with Just Sayin' and Altic at 8:30 p.m.
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