Also found in: Encyclopedia.
ASTRIHong Kong Applied Science and Technology Research Institute Company Limited
Copyright 1988-2018, All rights reserved.
References in periodicals archive ?
With a shared vision to spur innovation and enhance customer experience, the collaboration with ASTRI not only creates new opportunities for CITIC Telecom CPC, but also benefits a wide spectrum of vertical industries.
Through events like this, ASTRI hopes to develop the connection with the technology start-up community and provide necessary support to them.
Ming-yam Wong, chairman of the board of directors at ASTRI said, "The joint lab marks a new milestone in our cooperation with Comba, and together we will contribute our efforts to the transformation and betterment of Hong Kong and beyond through our smart city and smart home technologies."
Astri wants a normal life and dares to take fate into her own hands.
"As UWB technology advances and related protocols and industry standards mature, the introduction of this UWB MAC ASIC will enable IP-based high speed wireless digital electronics applications for consumer electronics markets," said Peter Diu, vice president of Wireless Multimedia Technologies Group, ASTRI. "UWB technology will be deployed in different market segments, including Wireless USB and IP based applications.
The CEVA-TeakLite's unique feature, which combines optimal performance and complete audio and imaging codec software, is the key factor for ASTRI's decision to licence the DSP.
"Through the partnership project with ASTRI as well as other new R&D initiatives, we endeavour to bring CITIC Telecom CPC to new heights--delivering a new level of benefits for our customers and society.
In the most recent years, leveraging the mandate of the CNERC Hong Kong Branch, ASTRI has developed a number of advanced and innovative solutions in various areas including Narrowband Internet of Things (NB-IoT), Bluetooth Low Energy (BLE), FinFET, design, Hall-sensor IC solutions, ultra-high-definition and 3D conversion video technologies, power electronics modules, high-density electronic packaging and Gallium Nitride (GaN)-based high density power modules.