AUSNAustralasian United Steam Navigation Co. Ltd. (Australia; est. 1887)
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When used in combination with quartz glass, which has high transmissivity of deep ultraviolet wavelengths, and AuSn sealant, which has excellent airtightness and durability, however, problems with cracking of the quartz glass and metallization[2] separation can occur.
AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Solder with gold-tin melts at 280[degrees]C (AuSn 80/20) and is particularly well suited for lasers in pulse mode.
With a conventional bonding technology using AuSn solder, however, it is used on the substrate of expensive aluminum nitride which is difficult to shift to face-down structures in terms of cost.
Forbes and myself, published two articles opposing the "prevailing view" in the January 2010 issue of Navy, the journal of the Association of the United States Navy (AUSN).
The ICs were die attached using gold-tin (AuSn) at 300[degrees]C on a pedestal in order to keep bond wire lengths to a minimum, between the chip and the input and output microstrip lines which were printed on 15 mil alumina substrate.
(a company of Tanaka Precious Metals) today announced that Tanaka Kikinzoku Kogyo K.K., which operates the Tanaka Precious Metals' manufacturing business will commence the provision of samples of gold-tin alloy bonding material (AuSn alloy lid) which is able to seal ultra-compact crystal oscillators(*1) with a mounting area of 1.2 mm x 1.0 mm at half the material cost of conventional products from March 22 (Friday).
Hermeticity is achieved by using a metal lid with a AuSn solder preform.