BBULBumpless Build up Layer
BBULBumpless Build-Up Layer (integrated circuit technology)
BBULBumpless Build-Up Layer (CPU packaging technology)
BBULBalfour Beatty Utilities Ltd. (UK)
References in periodicals archive ?
5 years to complete the project and is now being considered by BBUL for Phase 2 of its Work Management Solution, which will include mobile-enabing BBUL's existing Job Management and Scheduling system.
The development of BBUL technology will allow us to deliver the performance of billion-transistor processors to computers users.
BBUL packaging is thinner and lighter than today's chip packaging options.
This is the driving force behind BBUL technology research.
BBUL packaging eliminates use of these solder bumps completely.