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BEOLBack-End-of-Line (electronics)
BEOLBent's Old Fort National Historic Site (US National Park Service)
BEOLBent's Old Fort National Historic Site (La Junta, Colorado)
References in periodicals archive ?
In the paper, A Process-Variation-Cognizant Efficient MOL and BEOL TDDB Evaluation Method, IBM Systems engineers from the Fabless Reliability Group, with IBM Research engineers, developed a cognitive computing technique for optimal pre-screening and test sequencing to dramatically improve the efficiency of testing.
A highlight of the collaboration has been a massive process simulation experiment to explore the effect of process variability in 7nm BEOL (back end of line) fabrication processes.
Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today it received a follow-on order for its ORION([R]) Single Wafer Cleaning System from a leading semiconductor producer to be used for BEOL applications.
One customer will use the ORION([R]) System for FEOL all-wet photoresist stripping applications, using the high-temperature ViPR[TM] process, and the other customer will use the system for BEOL applications.
Leading integrated circuit manufacturers are recognizing that the closed chamber technology of the ORION[R] system, when used for BEOL applications, delivers highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties.
As part of the joint R&D agreement, SCREEN will advance process development on their AquaSpin SU-3200 single wafer cleaners for FEOL and BEOL applications as well as SOKUDO DUO coat/develop track processes for lithography patterning.
to add to its existing platforms 300mm LAM RESEARCH Versys 2300 dedicated to the FEOL a deposit and other deposits in the BEOL.
Foundry and logic manufacturers are finding low-k materials and metal film stacks used for advanced devices are much more sensitive to wet cleaning than previous generations of BEOL processes.
The logic and foundry chip providers that placed these orders currently use the ANTARES([R]) system for various BEOL particle removal processes including particle removal after in-line wafer testing and other high defectivity steps to focus on improving overall device yield.