A sputtering system is required for the expansion of the technology in the back-end-of-line
area of the semiconductor laboratory of the Max Planck Society.
Abstract: The objective of this study was to assess and improve reliability of back-end-of-line
(BEoL) region comprising of Cu/low-k interconnect layers and Far-BEoL (fBEoL) region consisting of flip chip (C4) [mu]-bumps during the process of die attachment to substrate.
Intrinsic reliability test applications are often segregated between back-end-of-line
(BEOL) and front-end-of-line (FEOL).
The company said the Supremas will be used in front-end-of-line (FEOL), mid-of-line (MoL) and back-end-of-line
(BEOL) strip applications for high-volume production at the 3Xnm technology nodes and advanced device development at the 2Xnm nodes.
Novellus' GxT system provides advanced photoresist strip technology for the most demanding applications, including low silicon loss, high dose implant strip, plasma assisted doping, and reducing chemistries required for back-end-of-line
Papers from a September 2006 conference, 86 in all, cover all aspects of the use of ultra-clean technology for large-scale integration of semiconductors, and cleaning and contamination-control in both front- end-of-line (FEOL) and back-end-of-line
Ziptronix licenses its technology throughout the semiconductor supply chain, including OEMs, IDMs and some fabrication and assembly facilities, and operates a back-end-of-line
R&D facility with 6,000 square feet (557m2) of Class 100/1000 cleanroom space at its headquarters in Research Triangle Park, N.
Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing cycle from Front to Back-End-Of-Line
Mattson's sustained strip leadership in the foundry market is proof that our systems continue to deliver the processing and productivity performance our customers value for both front-end-of-line and back-end-of-line
applications," said Stephen T.
In these proceedings from the September 2004 symposium, contributors describe their research in ten major topic areas, including surface preparation for gate dielectric with high dielectric constants, front-end-of-line and back-end-of-line
cleaning, rinsing and drying, wet and gaseous etching, challenges and cleaning methods for particles and alternative cleaning methods, metrology, contamination control, post-CMP cleaning, and wet photo resist removal.
The specialized technology, first introduced by UMC in late 2012 as the foundry industry's first, true 12-volt aluminum back-end-of-line
(BEoL) process, is developed for next generation touch controller IC and IoT applications.
The company holds expertize in sputtering (PVD) vacuum deposition equipment (in-line, cluster, and roll to roll), atomic layer deposition (ALD) equipment, back-end-of-line
(BEOL) equipment, and factory automation equipment (like clean stocker, clean crane, and overhead transfer system for major substrate).