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BGABall Grid Array
BGABoys Generally Asian (parody group)
BGABitmap Graphics
BGABattle Ground Academy (Franklin, TN)
BGABlue-Green Algae
BGABundesverband des Deutschen Groß– Und Außenhandels (Federation of German Wholesale and Foreign Trade)
BGABritish Gliding Association
BGABlueGreen Alliance (various locations)
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BGABill Graham Archives (rock memorabilia)
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BGABridge Group Address
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BGABucaramanga, Colombia - Palo Negro (Airport Code)
BGABerges de Garonne Auto (French vehicle rental company)
BGABritish Grooms Association (UK)
BGABiologie et Gestion des Adventices (French: Weed Biology and Management)
BGABusiness Growth Alliance, LLC
BGABeta Gimbal Assembly
BGABeginner's Guide to Aeronautics (web-based textbook; US NASA)
BGABureau Genevois d'Adoption (French: Geneva Office of Adoption; Geneva, Switzerland)
BGAButterfly Gardeners Association
BGABone GLA Protein (Osteocalcin: markers of bone formation)
BGABénin Golden Award (French film award)
BGABinary Genetic Algorithm
BGABroiler Growers Association
BGABuffer Gate Array
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References in periodicals archive ?
The SanDisk iSSD drive is the first flash SSD device to support the industry standard SATA interface in a small BGA (Ball Grid Array) package that can be soldered onto any motherboard, and that is fast enough for use with advanced operating systems in next-generation mobile computing platforms.
Called the iSSD drive, it is the first solid state drive to use a SATA interface in a small ball grid array package, and can be soldered onto any motherboard, and, is ideal for mobile platforms, such as netbooks, tablets, and phones.
The new 64GB iNAND EFD is based on an eight flash die stack design using SanDisk's advanced X3 32nm flash, and is offered in a 16x20x1.4mm form factor with a standard ball grid array (BGA) for quick integration into smartphone designs.
FIGURE 1 SHOWS a ball grid array solder joint after reflow soldering.
It is supplied in a 160-ball chip scale ball grid array for reduced package parasitics.
The GSC3e/LPa is available in 0.8-mm pitch ball grid array package and is integrated SiRF GRF3i+ GPS radio's dual-range IF band filter with a default 2-MHz bandwidth, created to resist radio frequency interference and improve vehicle platform integration.SiRF partnered with M/A-COM Technology Solutions (Lowell, MA; on a GPS module, which, when fitted with the SiRFDRive2 software, tracks wheel tick counts, vehicle speed and other sensor data that the module collects from the vehicle's CAN bus network and combines with GPS satellite signal measurements to position, heading and other metrics.
For additional information and further discussion about transitioning to alternate metallurgies, see the EMS Forum's recently published "Guidelines for Suppliers Transitioning to RollS Compliant Ball Grid Array (BGA) Packages with Low-Ag SAC Alloys."
The flash controller embedded within the low-profile ball grid array package handles error correction code, block erase and defect management functions.
The new device combines a broad range of analog and mixed-signal functions in a very small 4.6 x 4.6mm VFB GA84 (Very Fine Ball Grid Array) or 6 x 6mm TFBGA84 (Thin Flat Ball Grid Array) package.
Intel qualified its first lead-free Plastic Ball Grid Array package in 2001 for use with its Flash memory and shipped its first lead-free product in 2002.
In addition, LSI Logic's world-class flxI/O flip chip ball grid array package family and standard package families provide cost-effective solutions that meet the needs of today's high-performance systems.
The device is packaged in a 27mm X 27mm 456-lead Plastic Ball Grid Array (PBGA) and is pin- and API-compatible with TranSwitch's T3BwP and TEPro devices.