BGA

(redirected from Ball grid array)
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AcronymDefinition
BGABall Grid Array
BGABoys Generally Asian (parody group)
BGABitmap Graphics
BGABattle Ground Academy (Franklin, TN)
BGABlue-Green Algae
BGABundesgesundheitsamt
BGABundesverband des Deutschen Groß– Und Außenhandels (Federation of German Wholesale and Foreign Trade)
BGABritish Gliding Association
BGABlueGreen Alliance (various locations)
BGABehavior Genetics Association
BGABritish Go Association
BGABill Graham Archives (rock memorabilia)
BGABusiness General Aviation
BGABridge Group Address
BGABritish Gear Association (UK)
BGABrokerage General Agent (various companies)
BGABucaramanga, Colombia - Palo Negro (Airport Code)
BGABerges de Garonne Auto (French vehicle rental company)
BGABritish Grooms Association (UK)
BGABiologie et Gestion des Adventices (French: Weed Biology and Management)
BGABusiness Growth Alliance, LLC
BGABeta Gimbal Assembly
BGABeginner's Guide to Aeronautics (web-based textbook; US NASA)
BGABureau Genevois d'Adoption (French: Geneva Office of Adoption; Geneva, Switzerland)
BGAButterfly Gardeners Association
BGABone GLA Protein (Osteocalcin: markers of bone formation)
BGABénin Golden Award (French film award)
BGABinary Genetic Algorithm
BGABuffer Gate Array
BGABroiler Growers Association
References in periodicals archive ?
PBGA packages are a mature technology used in a wide range of applications and end markets, such as computing, network infrastructure, gaming, set top boxes and digital TV," said Pat O'Brien, Amkor's senior vice president, ball grid array products.
Inters new Flip Chip Ball Grid Array package also uses a tin/silver/copper alloy to connect the chip package to the motherboard.
It is available in ball grid array and costs USD96 in 1,000 unit quantities.
AMD developed the robust Known Good Die (KGD) program and the patented negative gate erase technology, and developed highly reliable Fine-pitch Ball Grid Array packaging.
It supports a wide variety of BGA formats including single devices in boats or trays and strip devices in magazines with the capability to process chip scale packages, plastic ball grid array, ceramic ball grid array, tape grid array, and connector package types.