(redirected from Bond Line Thickness)
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References in periodicals archive ?
The bonder is specially equipped for eutectic gold-tin (AuSn) attachment of devices, achieving bond line thickness less than 6[micro]m.
(a) Bond line thickness (mm) 0.1 0.3 Test 1 Test 2 Test 3 Test 1 Test 2 Test 3 Test 1 x (Mpa) 14.52 3.18 3.08 13.28 3.37 3.71 12.82 Max.
This advanced product platform includes an optional formulation that incorporates glass beads to control bond line thickness during assembly.
The best performing bond line thickness was found to be in the range of 0.15 to 0.20 mm.
This process should yield a uniform bond line thickness and adequate adhesion.
The surface preparation, contact pressure during consolidation, heating and cooling rates, hold times at melt and recrystallization temperature, effect of bond line thickness and uniformity, and anodization to increase durability were included in the process development (10).
MG-122, a second-generation Gelease(tm) product, is a thermally conductive adhesive that can be used with a bond line thickness, down to 2 mils, to minimize the thermal pathway and maximize heat-flow.
While adhesives exist that are meant for applications involving dissimilar material with large differences in TCE, care still must be taken with regard to the bond line thickness. Since the stress that produces failure in the adhesive is a function of temperature, substrate size, the difference in TCE of the two adherends, the elastic modulus, the thicknesses of all rigid materials and the thickness of the adhesive joint (and with most variables predetermined in this application), the only variable remaining to reduce the stress for a given adhesive is the thickness of the adhesive joint.
Dow Corning's new product line encompasses four grades, distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses. Dow Corning TC-4015 and TC-4016 Dispensable Thermal Pads offer thermal conductivity of 1.5 W/mK, while Dow Corning TC-4025 and TC-4026 Dispensable Thermal Pads offer higher 2.5 W/mK thermal conductivity.
The high conductivity translates to less sensitivity to bond line thicknesses and coplanarity issues than polymeric TIMs.
Regarding EPI adhesives, which are even more sensitive to glue line thickness than PU adhesives, the recently finalized requirement standard (CEN 2013b) specifies bond line thicknesses during testing of 0.1 to 0.3 mm, depending on the intended use of the adhesive; this is further addressed below.