CHIPPACCost-Effective High-Performance Packaging for Electronic Systems
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In an evening session on high-density packaging technologies in the era of big data, speakers from Fujitsu, IBM Research, JCET, Stats ChipPac, Shinko Electric, and Hitachi Chemical discussed some of the packages required.
STATS ChipPAC 's new production facility will use Air Products' nitrogen for the manufacture of advanced flip chip, wirebond and 3D packaging solutions.
STATS ChipPAC is a long-term strategic partner of TSMC, making it the primary beneficiary of the foundry's outsourcing plan.
Semiconductor test and packaging service provider STATS ChipPAC Ltd (SGX-ST:STATSChP) said on Thursday that it has started building a new factory in Singapore.
5 January 2011 - S&P today rated at BB+ the planned USD200m (EUR151m) senior unsecured notes offer by Singapore semiconductor packaging design and assembly services provider STATS ChipPAC Ltd (SIN:S24).
Edhi, ChipPAC, and other welfare organizations ambulances faced difficulties in reaching the spot due to narrow streets and densely populated location.
Several companies have licensed eWLB and production lines have been installed at ASE and STATS ChipPAC. Infineon, STATS ChipPAC and STMicroelectronics are proposing eWLB as a standard for future-generation products.
On 17 Dec 2008, STATS ChipPAC Ltd, a leading semiconductor test and advanced packaging service provider, announced a restructuring plan to better align its operations with business outlook as a result of the global semiconductor downturn.
(NASDAQ: KLIC), Willow Grove, Pa., has received orders for Model 8028 IC Ball Bonders totaling $15M from ChipPAC Inc.
Hyundai Electronics Industries Co and its US subsidiary, Hyundai Electronics America Inc, have agreed to sell a 90% interest in their ChipPAC business to a group of investors led by existing management.
Hangzhou Hikvision Digital, Hilong Holding, STATS ChipPac, Fufeng Group (Fufeng), Shandong STON Group and Zoomlion Heavy Industry Science and Technology (Zoomlion) were identified as having higher exposure although still limited in absolute terms.
Papers from research organizations such as Fraunhofer, ITRI and IME A*Star, along with companies including Amkor, ASE, Nanium, SPIL, Stats ChipPAC and TSMC, discussed advances with FOWLP.