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References in periodicals archive ?
Walls, "Ceramic column grid array (CCGA) module for a high performance work station application," in 1997 Proceedings 47th Electronic Components and Technology Conference, pp.
Ramesham, "Reliability of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications," Journal of Microelectronics and Electronic Packaging, vol.
Abstract: Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications because of their inherent advantages, such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface mount technology (SMT) packaging assembly processes.
Figure 3 shows the results of a study on several types of BGAs (a large ceramic column grid array, PBGAs, a medium-sized CBGA and [U]BGAs) in an exploratory dispense test of a candidate underfill formulation.
This paper presents thermal cycle test results for a ceramic column grid array (CCGA) and its PBGA version, both having 560 I/Os, exposed to two different thermal cycle regimes.
The ceramic column grid array (CCGA) package is used today in numerous applications because of its many advantages: high interconnection density; compatibility with standard surface-mount assembly techniques; excellent thermal and electrical performance; and high interconnectivity.
Ceramic column grid array for flip chip applications.
CLASP ceramic column grid array technology for flip chip carriers.
Ceramic ball grid array (CBGA) and ceramic column grid array (CCGA) packages remain common for exceptionally high pin count application specific integrated circuits (ASICs) and processors.
This is apparent when reworking boards with ceramic column grid arrays or components where high temperature, non-melting solder balls or columns are used.
The machine places components that range from 0201, flip chips and ceramic column grid arrays (CCGAs) to custom components with 100 g and dimensions of 85 x 85/125 x 10 mm at a rate of up to 45,000 components/hour.
die or 0201 capacitors) and larger (such as 50 mm ceramic column grid arrays (CCGAs) or 22 mm semiconductor chips] on different substrates like ceramic, flexible circuits or printed circuit boards (PCBs).