DSBGADie-Sized Ball Grid Array (IC packaging)
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* Various package options, including DIP, TSSOP, QFN, and DSBGA, for design flexibility.
The fine-pitch BGA (FBGA) package category includes the die size (DSBGA) package variation (a package that closely follows the actual die outline).
Some suppliers of FBGAs and DSBGAs understand the challenges facing the designer in circuit routing and have maintained a constant 0.30 mm contact diameter to maximize conductor routing channels on the outer surface of the circuit board.