E-PACElectronic Packaging and Assembly Concept
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E-PAC (Electronic Packaging Assembly Concept) was developed by four engineers at Hewlett-Packard's Boeblinger, Germany, facility.
An added benefit of E-PAC is a significant reduction in MTTR (mean-time-to-repair), a particularly valuable asset in those applications which mandate zero downtime.
The ExP Line also features the 4U ExP414 with revolutionary E-PAC (Electronic Packaging Assembly Concept) -- A "no screw, no tooling required" platform that offers a significant reduction in MTTR and integration cost.