E-PACElectronic Packaging and Assembly Concept
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The PxV4l4 flexible, scalable 4U open-architecture system, by PEP Modular Computers, not only accommodates two platform configurations and several 110 interfaces, it also boasts E-PAC construction, a lightweight, foam-based chassis and housing concept.
E-PAC (Electronic Packaging Assembly Concept) was developed by four engineers at Hewlett-Packard's Boeblinger, Germany, facility.
Since its founding in 1994, DMT has gained international awareness with its innovative and award-winning chassis-concept E-PAC product for the electronic-packaging market -- an expanded polypropylene foam that replaces the familiar metal-chassis structure.