While reviewing these calls, EMPF staff consulted its Industrial Advisory Board, which encountered precisely this scenario during participation in the most quoted and thorough military-environment qualification study of Pb-free electronics solder joint reliability yet conducted: the JGPP study by NASA, the Joint Council on Aging Aircraft, and other defense industry leaders.
The EMPF Helpline staff investigated whether SAC 305-finished chips and BGAs could be soldered with SnPb solder.
was established as a ROSA restoration technology Center of Excellence able to support both commercial industry and DoD depot repair facilities.
A customer contacted the EMPF
Helpline concerning a solder wetting problem observed during Pb-free SMT wave soldering of a goldplated PCB.
This process was developed by the EMPF using customer-supplied ceramic components.
By following these basic DfM principles and instituting the reballing procedure developed at the EMPF, the customer was able to achieve a higher yield and higher volume manufacturing.
Within a two-week period, the EMPF
(Electronics Manufacturing Productivity Facility) Helpline received four calls asking whether it is possible to solder, using SnPb, a component with a SnAgCu finish and whether there are reliability concerns.
operates as a National Electronics Manufacturing Center of Excellence, with funding coming from industry, academia and government.
It was not as simple as acquiring and installing a new solder pot, the EMPF
also performed extensive research on the performance of conformal coatings versus no-clean flux residue.