ENVMEnvironmental Monitoring
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In the future, Hua Hong Semiconductor will continue to leverage its technical expertise in BCD and eNVM processes, and integrate the two to create high-end power management SOCs for intelligent power products.
Microsemi's SmartFusion[R]2 evaluation kit is the lowest cost SoC FPGA platform for developing cost optimized SoC FPGA designs using Microsemi's SmartFusion2 System-on-Chip (SoC) FPGAs, which integrate inherently reliable flash based FPGA fabric, a 166MHz ARM[R]Cortex[TM]-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM, and industry required high performance communication interfaces, all on a single chip.
eCBRAM technology was developed through Altis' partnership with Adesto Technologies and will enhance the Altis eNVM (embedded non-volatile memory) foundry service portfolio, today based on 130nm CMOS technologies.
HONG KONG, June 14, 2018 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", stock code: 1347.HK), a global leading specialty wafer manufacturer, today announced the analog IP portfolio for ultra low power MCUs has been developed independently by the Company based on its proven 0.11um Ultra Low Leakage eNVM Platform ("0.11um ULL platform").
Based on its leading eNVM technology, Hua Hong Semiconductor has seized this market opportunity to proactively develop its financial IC card chip business through close cooperation with domestic and international smart card chip manufacturers.